Comply with OCP M-CRPS specificationHigh-Power Capability: Supports up to 4500W (4 layers and 6oz copper for each layer)Multi-Contact Power Design: Enhances conductivity and reduces contact resistanceStable Signal Structure: Recessed terminal design prevents damage during matingEfficient Thermal Performance: Enhanced cooling design for superior heat dissipationHigh Assembly Accuracy: PIP-compatible design ensures precise PCB alignment

High Power: Supports OCP ORV3, 48 V high current.Thermistor Integration:    Real-time connector temperature monitoringPolarity Color Coding: Red (+), Black (–) for easy identificationMultiple Configurations: Cable, braided, and solid busbar versionsCustomization Options: Wire type, AWG, length, busbar dimensions

Pin count 20P through 120PSelf-Alignment MechanismFloating DesignDedicated Power pin/Ground pin design8Gbps NRZ/16Gbps PAM4100 Mating cycle

High Power up to 120A per pin; Low Power up to 30A per pin.            20.85mm board height, ideal for 1U/2U power and distribution systems.            High-airflow design for efficient heat dissipation and cooling.            Halogen-free material for environmental compliance.            Available in right-angle male and female versions.            Power and signal pin layout customizable per customer requirements.            Operating temperature: -40°C to +125°C for harsh environments.